Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1wt% nano-ZrO2 composite solder on OSP-Cu pads
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference26 articles.
1. Influence of the addition of indium on the mechanical creep of Sn–3.5%Ag alloy
2. Interfacial reactions between Sn–8Zn–3Bi–xAg lead-free solders and Cu substrate
3. Effect of small Sn–3.5Ag–0.5Cu additions on the structure and properties of Sn–9Zn solder in ball grid array packages
4. Pb-free solder-alloy based on Sn–Zn–Bi with the addition of germanium
5. High temperature synthesis of Sn–3.5Ag–0.5Zn alloy nanoparticles by chemical reduction method
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