Funder
National Science Centre Poland
National Centre for Research and Development
Reference27 articles.
1. Main application limitations of lead-free composite solder doped with foreign reinforcements;Chen;J. Mater. Sci.: Mater. Electron.,2021
2. Recent progress of Sn-Ag-Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging;Wu;J. Mater. Sci.: Mater. Electron.,2016
3. Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing, and reflow cycle;Chen;Solder. Surf. Mnt. Tech.,2016
4. Effect of nanoparticles addition on the microstructure and properties of lead-free solders: a review;Zhang;App. Sci.,2019
5. Effects of nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder;Tsao;Mater. Des.,2010
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