Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solder-Reference-Cited by-同舟云学术

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Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solder

Published:2015-06 Issue: Volume:636 Page:484-492
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Chen Guang,Wu Fengshun,Liu Changqing,Xia Weisheng,Liu Hui

Funder

National Nature Science Foundation of China

Research Grants Council

China-European Union Technology Cooperation

Marie Curie International Research Staff Exchange Scheme Project

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference46 articles.

1. Electronics Without Lead

2. Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications

3. Effect of alloying elements on properties and microstructures of SnAgCu solders

4. Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder

5. Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

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1. Nanoparticle-reinforced solder alloys: A comprehensive review of recent formulation properties, and mechanical performance;Journal of Materials Research and Technology;2024-09

2. Research Overview on the Electromigration Reliability of SnBi Solder Alloy;Materials;2024-06-11

3. A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics;Journal of Materials Science;2022-05

4. Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressing;Soldering & Surface Mount Technology;2021-12-02

5. Study on the correlation between spreadability and wetting driving force of Ni-GNSs reinforced SnAgCuRE composite solder;Materials & Design;2021-12

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