Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference32 articles.
1. Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder
2. Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
3. Interfacial reaction between Sn-0.7Cu (-Ni) solder and Cu substrate
4. Effect of TiO2 nanoparticles on the microstructure and bonding strengths of Sn0.7Cu composite solder BGA packages with immersion Sn surface finish
5. AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint under thermal aging
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