Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni–P/Sn–3.5Ag solder joint
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference18 articles.
1. Direct correlation between mechanical failure and metallurgical reaction in flip chip solder joints
2. Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni(P)/Cu bond pad
3. Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints
4. Tin–lead (SnPb) solder reaction in flip chip technology
5. Electroless Plating: Fundamental and Applications;Mallory,1990
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4. Significant Inhibition of IMCs Growth between an Electroless Ni-W-P Metallization and SAC305 Solder During Soldering and Aging;Journal of Wuhan University of Technology-Mater. Sci. Ed.;2019-02
5. Thermoelectric Devices for Power Generation: Recent Progress and Future Challenges;Advanced Engineering Materials;2015-09-22
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