Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints-Reference-Cited by-同舟云学术

Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints

Published:2005-01 Issue:1 Volume:36 Page:65-75
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:Metall and Mat Trans A

Author:

He Min,Chen Zhong,Qi Guojun

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s11661-005-0139-7.pdf

Reference30 articles.

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3. M. He, Z. Chen, and G.J. Qi: Acta Mater., 2004, vol. 52, pp. 2047–56.

4. K. Kishimoto, M. Omiya, and M. Amagai: Proc. 3rd Int. Symp. on Electronic Materials and Packaging, Cheju, Korea, IEEE, New York, NY, 2002, pp. 8–14.

5. H.T. Lee and M.H. Chen: Mater. Sci. Eng. A, 2002, vol. 333, pp. 24–34.

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