Microstructural, mechanical, electrical, and thermal properties of the Bi-Sn-Ag ternary eutectic alloy
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s11595-017-1573-2.pdf
Reference23 articles.
1. Deng X, Sidhu RS, Johnson P, et al. Influence of Reflow and Thermal Aging on the Shear Strength and Fracture Behavior of Sn-3.5Ag Solder/Cu Joints[J]. Metallurgical and Materials Transactions A, 2005, 36(1): 55–64
2. He M, Chen Z, Qi GJ. Mechanical Strength of Thermal Aged Sn-3.5Ag/Ni-P Solder Joints[J]. Metallurgical and Materials Transactions A, 2005, 36A: 65–75
3. Kamal M, El Said Gouda, Marei L K. Effect of Bi-Content on Hardness and Micro-Creep Behavior of Sn-3.5Ag Rapidly Solidified Alloy[J]. Crystal Reseasch and Technology, 2009, 44(12): 1308–1312
4. Arenas M F, Acoff V L. Contact Angle Measurements of Sn-Ag and Sn-Cu Lead-Free Solders on Copper Substrate[J]. Journal of Electronic Materials, 2004, 33: 1452–1458
5. Arenas M F, He M, Acoff V L. Effect of Flux on the Wetting Characteristics of SnAg, SnCu, SnAgBi, and SnAgCu Lead-Free Solders on Copper Substrates[J]. Journal of Electronic Materials, 2006, 35: 1530–1536
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Microstructural analysis and thermal conductivity of the Ag–Bi–Sn alloys;Thermochimica Acta;2022-11
2. Microstructures and Thermal Properties of Sn–Bi–Zn–Ga Alloys as Heat Transfer and Heat Storage Materials;Journal of Wuhan University of Technology-Mater. Sci. Ed.;2019-06
3. Microstructures and thermal properties of Sn–Bi–Pb–Zn alloys as heat storage and transfer materials;Rare Metals;2019-02-22
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3