Microstructural analysis and thermal conductivity of the Ag–Bi–Sn alloys

Author:

Manasijević DraganORCID,Balanović Ljubiša,Marković Ivana,Gorgievski Milan,Stamenković Uroš,Božinović Kristina,Minić Duško,Premović Milena

Publisher

Elsevier BV

Subject

Physical and Theoretical Chemistry,Condensed Matter Physics,Instrumentation

Reference32 articles.

1. Properties and microstructures of Sn-Bi-X lead-free solders;Yang;Adv. Mater. Sci. Eng.,2016

2. A review: on the development of low melting temperature Pb-free solders;Kotadia;Microelectron. Reliab.,2014

3. Effect of temperature and substrate surface roughness on wetting behavior and interfacial structure between Sn–35Bi–1Ag solder and Cu substrate;Li;J. Mater. Sci: Mater El.,2020

4. Structural and thermal properties of Sn–Ag alloys;Manasijević;Solid State Sci.,2021

5. On the Sn-Bi-Ag ternary phase diagram;Kattner;J. Electron. Mater.,1994

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