Effect of Bi-content on hardness and micro-creep behavior of Sn-3.5Ag rapidly solidified alloy
Author:
Publisher
Wiley
Subject
Condensed Matter Physics,General Materials Science,General Chemistry
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/crat.200900414/fullpdf
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1. Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review
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