Selective metallization of glass with improved adhesive layer and optional hydrophobic surface
Author:
Funder
Xiamen University
Shenzhen Institutes of Advanced Technology Chinese Academy of Sciences
Publisher
Elsevier BV
Subject
Colloid and Surface Chemistry
Reference38 articles.
1. Preliminary design of a novel AlN-Al composite coating used for micro-electronic packaging via finite element modeling;Li;Mater. Lett.,2020
2. Advanced reliability study of TSV interposers and interconnects for the 28nm technology FPGA;Banijamali,2011
3. High-frequency modeling of TSVs for 3-D chip integration and silicon interposers considering skin-effect, dielectric quasi-TEM and slow-wave modes;Ndip;IEEE Trans. Compon. Packaging Manuf. Technol.,2011
4. Nonlinear thermal stress/strain analyses of copper filled TSV (through silicon via) and their flip-chip microbumps;Selvanayagam;Ieee Trans. Adv. Packag.,2009
5. Through-glass vias for glass interposers and MEMS packaging applications fabricated using magnetic assembly of microscale metal wires;Laakso;IEEE Access,2018
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