Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps-Reference-Cited by-同舟云学术

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Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps

Published:2009-11 Issue:4 Volume:32 Page:720-728
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Selvanayagam C.S.,Lau J.H.,Xiaowu Zhang ,Seah S.,Vaidyanathan K.,Chai T.C.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/5286959/05170003.pdf?arnumber=5170003

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