Preliminary design of a novel AlN-Al composite coating used for micro-electronic packaging via finite element modeling-Reference-Cited by-同舟云学术

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Preliminary design of a novel AlN-Al composite coating used for micro-electronic packaging via finite element modeling

Published:2020-12 Issue: Volume:280 Page:128598
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Li Guangshu^ORCID,Wang Chaohui^ORCID,Zhang Huanyu,Zhuang Mingxiang,Hu Zhongchao,Liu Yao,Wang Liang

Funder

National Natural Science Foundation of China

Major Research Plan

Natural Science Foundation of Heilongjiang Province

Harbin Engineering University

Youth Innovation Promotion Association of the Chinese Academy of Sciences

Natural Science Foundation of Shanghai

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference12 articles.

1. Novel organic-inorganic composites with high thermal conductivity for electronic packaging applications: A key issue review

2. High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging

3. H. Scott, Glass metal seal, US Patent 2062335, 1936.

4. Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging

5. Thermal, mechanical and dielectric properties of flexible BN foam and BN nanosheets reinforced polymer composites for electronic packaging application

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1. A Critique on the Role of Object-Oriented Finite Element Analysis (OOF2) in Predicting Thermal and Mechanical Properties in Thermal Sprayed Coatings;Journal of Thermal Spray Technology;2024-06-17

2. Delamination of Plasticized Devices in Dynamic Service Environments;Micromachines;2024-03-11

3. Characterization of cordierite based h‐BN doped ceramics as an electronic substrate/circuit board material;International Journal of Applied Ceramic Technology;2022-09-03

4. Industrially fabricated in-situ Al-AlN metal matrix composites (part B): The mechanical, creep, and thermal properties;Journal of Alloys and Compounds;2022-07

5. Microstructure and Properties of Jet Pulse Electrodeposited Ni-TiN Nanocoatings;Journal of Materials Engineering and Performance;2022-04-21

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