Investigation on curing characterization of epoxy molding compounds with different latent catalysts by thermal, electrical and mechanical analysis

Author:

Lee Da Eun,Cho Han-Jung,Kong Byung-Seon,Choi Hyung Ouk

Publisher

Elsevier BV

Subject

Physical and Theoretical Chemistry,Condensed Matter Physics,Instrumentation

Reference30 articles.

1. Effects of curing accelerators on physical properties of epoxy molding compound (EMC);Ogata;J. Appl. Polym. Sci.,1992

2. Elucidating how advanced organophosphine accelerators affect molding compounds;Su;Ind. Eng. Chem. Res.,2013

3. Thermal and cure kinetics of epoxy molding compounds cured with thermal latency accelerators;Su;Adv. Mater. Sci. Eng. Int. J.,2013

4. A Study on the Influence of the Temperature on the Formation of Cardanol-Based Phenolic Resin;Shukla;Int. J. Chem. Kinet.,2013

5. Cure kinetics of biphenyl epoxy resin system using latent catalysts;Kim;J. Appl. Polym. Sci.,2001

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