Curing and rheological study of epoxy molding compound with novel phosphonium silicate latent accelerators-Reference-Cited by-同舟云学术

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Curing and rheological study of epoxy molding compound with novel phosphonium silicate latent accelerators

Published:2022-06-15 Issue:9 Volume:33 Page:2908-2920
ISSN:1042-7147
Container-title:Polymers for Advanced Technologies
language:en
Short-container-title:Polymers for Advanced Techs

Author:

Yu Yongjia¹²,Yang Xin¹^ORCID,Liu Qianfa³,She Naidong³,Liu Dongliang³,Huang Wei¹²

Affiliation:

1. Key Laboratory of Science and Technology on High‐Tech Polymer Materials, Institute of Chemistry Chinese Academy of Sciences Beijing PR China

2. University of Chinese Academy of Sciences Beijing PR China

3. National Engineering Research Center of Electronic Circuits Base Materials Shengyi Technology Co., Ltd Dongguan PR China

Publisher

Wiley

Subject

Polymers and Plastics

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pat.5758

Reference29 articles.

1. A Study on the Effect of Epoxy Molding Compound (EMC) Rheology During Encapsulation of Stacked-CHIP Scale Packages (S-CSP)

2. The Effects of Particle Size-Matching Filling of Spherical Silica on the Flowability of Epoxy Molding Compounds for Large-Scale Integrated Circuits Packaging

3. Influence of Filler Content and Filler Size on the Curing Kinetics of an Epoxy Resin

4. Thermal and cure kinetics of epoxy molding compounds cured with thermal latency accelerators;Su CC;Adv Mater Sci Eng,2013

5. Latent curing epoxy systems with reduced curing temperature and improved stability

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1. Modeling the cure shrinkage–induced warpage of epoxy molding compound;International Journal of Mechanical Sciences;2024-04

2. Effect of blend ratio and graphene loading on the properties of epoxy/phenolic/graphene conductive materials;AIP Conference Proceedings;2024

3. Improving Moldability by Regulating Thixotropy of Epoxy Molding Compounds;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

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