Elucidating How Advanced Organophosphine Accelerators Affect Molding Compounds-Reference-Cited by-同舟云学术

Elucidating How Advanced Organophosphine Accelerators Affect Molding Compounds

Published:2013-02-11 Issue:7 Volume:52 Page:2528-2536
ISSN:0888-5885
Container-title:Industrial & Engineering Chemistry Research
language:en
Short-container-title:Ind. Eng. Chem. Res.

Author:

Su Chean-Cheng¹,Wei Chien-Huan¹,Yang Chih-Chieh¹

Affiliation:

1. Department of Chemical and Materials Engineering, National University of Kaohsiung, No.700, Kaohsiung University Road, Nan-Tzu District, Kaohsiung, 811, Taiwan, ROC

Publisher

American Chemical Society (ACS)

Subject

Industrial and Manufacturing Engineering,General Chemical Engineering,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/ie302347r

Reference36 articles.

1. Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices

2. Curing reaction of o-cresol novolac epoxy resin according to hardener change

3. Effects of curing accelerators on physical properties of epoxy molding compound (EMC)

4. Curing reaction of biphenyl epoxy resin with different phenolic functional hardeners

5. Thermal shock test of integrated circuit packages sealed with epoxy moulding compounds filled with spherical silica particles

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