Author:
Liao X.,Sampurno Y.,Zhuang Y.,Rice A.,Sudargho F.,Philipossian A.,Wargo C.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. Evaluation of Pad Groove Designs under Reduced Slurry Flow Rate Conditions during Copper CMP
2. Effect of Retaining Ring Slot Design on Slurry Film Thickness during CMP
3. A. Philipossian, X. Wei, R. Dittler, J. Cheng, Y. Zhuang, C. Wargo, R. Stankowski, Presented at the 13th International Symposium on Chemical-mechanical Planarization, Lake Placid, New York, August 10–13, 2008.
4. Effect of Slurry Application∕Injection Schemes on Slurry Availability during Chemical Mechanical Planarization (CMP)
Cited by
13 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献