Evaluation of Pad Groove Designs under Reduced Slurry Flow Rate Conditions during Copper CMP-Reference-Cited by-同舟云学术

Evaluation of Pad Groove Designs under Reduced Slurry Flow Rate Conditions during Copper CMP

Published:2008 Issue:10 Volume:155 Page:H812
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Rosales-Yeomans D.,DeNardis D.,Borucki L.,Suzuki T.,Sampurno Y.,Philipossian A.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference22 articles.

1. E. Mitchell , M.S. Thesis, Department of Chemical and Environmental Engineering, University of Arizona, Tucson, AZ (2002).

2. D. Rosales-Yeomans , Ph.D. Thesis, Department of Chemical and Environmental Engineering, University of Arizona, Tucson, AZ (2007).

3. Effects of Disk Design and Kinematics of Conditioners on Process Hydrodynamics during Copper CMP

4. J. Cornely , Master’s Thesis, Tufts University, Medford, MA (2003).

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