1. N. V. Gitis, J. Xiao, A. Kumar, and A. K. Sikder , in
Proceedings of Ninth CMP-MIC Conference
, Institute for Microelectronics on Chip Inter Connection (2004).
2. A. Philipossian, X. Wei, Y. Sampurno, F. Sudargho, Y. Zhuang, C. Wargo, and L. Borucki , in
ICPT CMP Technology Proceedings
, CMP Users Groups of Germany, Japan, Korea, Taiwan, and USA, p. 31 (2007).
3. D. Rosales-Yeomans , Ph.D. Thesis, University of Arizona, Tucson, AZ (2007).
4. Implications of Wafer-Size Scale-up on Frictional, Thermal, and Kinetic Attributes of Interlayer Dielectric CMP Process