1. T. Yamamoto, Y. Yamashita, M. Harada, N. Taoka, K. Ikeda, K. Suzuki, O. Kiso, N. Sugiyama, S. Takagi, in: IEEE International Electron Devices Meeting Technical Digest, 2007, pp. 1041–1044.
2. K. Romanjek, L. Hutin, C. Le Royer, A. Pouydebasque, M.-A. Jaud, C. Tabone, E. Augendre, L. Sanchez, J.-M. Hartmann, H. Grampeix, V. Mazzocchi, S. Soliveres, R. Truche, L. Clavelier, P. Scheiblin, X. Garros, G. Reimbold, M. Vinet, F. Boulanger, S. Deleonibus, in: Proceedings of European Solid-State Device Research Conference, 2008, pp. 75–78.
3. J. Mitard, B. De Jaeger, F.E. Leys, G. Hellings, K. Martens, G. Eneman, D.P. Brunco, R. Loo, J.C. Lin, D. Shamiryan, T. Vandeweyer, G. Winderickx, E. Vrancken, C.H. Yu, K. De Meyer, M. Caymax, L. Pantisano, M. Meuris, M.M. Heyns, in: IEEE International Electron Devices Meeting Technical Digest, 2008, pp. 873–876.
4. Reduced pressure-chemical vapor deposition of intrinsic and doped Ge layers on Si(001) for microelectronics and optoelectronics purposes