Bottom up deposition of advanced iPVD Cu process integrated with iPVD Ti and CVD Ru-Reference-Cited by-同舟云学术

Bottom up deposition of advanced iPVD Cu process integrated with iPVD Ti and CVD Ru

Published:2012-04 Issue: Volume:92 Page:76-78
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Ishizaka Tadahiro,Sakuma Takashi,Kawamata Masaya,Yokoyama Osamu,Kato Takara,Gomi Atsushi,Yasumuro Chiaki,Toshima Hiroyuki,Fukushima Toshihiko,Mizusawa Yasushi,Hatano Tatsuo,Hara Masamichi

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference10 articles.

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4. C.C. Yang, et al., International Interconnect Technology Conference (IITC), 2006, pp. 187–189.

5. J. Rullan, et al., International Interconnect Technology Conference (IITC), 2010.

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