Water management on semiconductor surfaces-Reference-Cited by-同舟云学术

Water management on semiconductor surfaces

Published:2011-12 Issue:12 Volume:88 Page:3432-3436
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Le Tiec Y.,Ventosa C.,Rochat N.,Fournel F.,Moriceau H.,Clavelier L.,Rieutord F.,Butterbaugh J.,Radu I.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference12 articles.

1. S. E. Park et al., Sematech Surface Preparation and Cleaning Conference (2007).

2. N. Kurumoto et al., Ultra Clean Processing of Semiconductor Surfaces conference (2008).

3. Q. Y. Tong et al., Semicond, Wafer Bonding Science & Technology, J. Wiley & Sons, 1999.

4. Hydrophilic low-temperature direct wafer bonding

5. Y. Le Tiec et al., Sematech Surface Preparation and Cleaning Conference (2008 and 2009).

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