Author:
Hang C.J.,Lum I.,Lee J.,Mayer M.,Wang C.Q.,Zhou Y.,Hong S.J.,Lee S.M.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference15 articles.
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4. Critical study of thermosonic copper ball bonding
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