Development and Status of Cu Ball/Wedge Bonding in 2012-Reference-Cited by-同舟云学术

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Development and Status of Cu Ball/Wedge Bonding in 2012

Published:2013-01-05 Issue:3 Volume:42 Page:558-595
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Schneider-Ramelow Martin,Geißler Ute,Schmitz Stefan,Grübl Wolfgang,Schuch Bernhard

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-012-2383-0.pdf

Reference115 articles.

1. B.K. Appelt, A. Tseng, and Y.-S. Lai, 3rd Electronic System Integration Technology Conference (Berlin: 2010).

2. J. Foley, H. Clauberg, and B. Chylak, 3rd Electronic System Integration Technology Conference (Berlin: 2010).

3. L. England and T. Jiang, 57th Electronic Components and Technology Conference (Reno: 2007), p. 1604.

4. E. Milke and T. Mueller, 10th Electronics Packaging Technology Conference (Singapore: 2008), p. 951.

5. T. Uno, K. Kimura, and T. Yamada, Proceedings EMPC 2009, June 15–18, (Rimini: 2009).

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