1. Harman GG: ‘Wire bonding in microelectronics – materials, processes, reliability, and yield’, 2nd edn; 1997, New York, McGraw Hill.
2. Zhou Y: ‘Microjoining and nanojoining’; 2008, Cambridge, Woodhead Publishing Ltd.
3. Singh I, On JY, Levine L: ‘Enhancing fine pitch, high I/O devices with copper ball bonding’, Proc. IEEE Conf. on ‘Electronic components and technology’, Lake Buena Vista, FL, USA, May–June 2005, IEEE, 843–847.
4. Hong SY, Hang CJ, Wang CQ: ‘Experiment research of copper wire ball bonding’, Proc. IEEE, 6th Int. Conf. on ‘Electronic packaging technology’, Shenzhen, China, August–September 2005, IEEE, 1–5.
5. Development of copper wire bonding application technology