Author:
Shin Younhwan,Kim Sarah Eunkyung,Kim Sungdong
Funder
National Research Foundation of Korea
Seoul National University of Science and Technology
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
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4. An investigation into warpages, stresses and keep-out zone in 3D through-silicon-via DRAM packages
5. Numerical and experimental characterization of the thermal behavior of a packaged DRAM-on-logic stack;Oprins,2012
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