Wafer level Cu–Cu direct bonding for 3D integration

Author:

Kim Sarah Eunkyung,Kim Sungdong

Funder

Ministry of Education

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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4. M. Jürgen Wolf, et al., Electronic Components and Technology Conference, 1, 2008, pp. 1–2.

5. Electrical and Mechanical Properties of Through-Silicon Vias and Bonding Layers in Stacked Wafers for 3D Integrated Circuits

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