Investigation of heat dissipation structure embedded in substrate of power chip based on grid-type thermal through silicon vias-Reference-Cited by-同舟云学术

Investigation of heat dissipation structure embedded in substrate of power chip based on grid-type thermal through silicon vias

Published:2024-06-10 Issue:11 Volume:21 Page:20240185-20240185
ISSN:1349-2543
Container-title:IEICE Electronics Express
language:en
Short-container-title:IEICE Electron. Express

Author:

Hu Rui¹,Lu Linhong¹,Bai Zhongchen¹²,Yang Fashun¹²³,Ma Kui¹²³,Ding Zhao¹²³

Affiliation:

1. Dept. of Electronics, Guizhou University

2. Semiconductor Power Device Reliability Engineering Research Center of Ministry of Education

3. Guizhou Provincial Key Lab for Micro-Nano-Electronics and Software

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Link

https://www.jstage.jst.go.jp/article/elex/21/11/21_21.20240185/_pdf

Reference30 articles.

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