Funder
National S&T Major Project 02
Microelectronics Devices & Bulk Si FinFET Integrated Technology
Institute of Microelectronics
Chinese Academy of Sciences
Youth Innovation Promotion Association of CAS
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. Migrating from planar to FinFET for further CMOS scaling: SOI or bulk?;Chiarella,2009
2. A 22nm high performance and low-power CMOS technology featuring fully-depleted tri-gate transistors, self-aligned contacts and high density MIM capacitors;Auth,2012
3. A 14nm logic technology featuring 2nd-generation FinFET, air-gapped interconnects, self-aligned double patterning and a 0.0588μm2 SRAM cell size;Natarajan,2014
4. Optimization of SiGe selective epitaxy for source/drain engineering in 22nm node complementary metal-oxide semiconductor (CMOS);Wang;J. Appl. Phys.,2013
5. Integration of highly-strained SiGe materials in 14nm and beyond nodes FinFET technology;Wang;Solid State Electron.,2015
Cited by
20 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献