Study of metal barrier deposition-induced damage to porous low-k materials

Author:

Zhao Larry,Volders Henny,Baklanov Mikhail,Tőkei Zsolt,Pantouvaki Marianna,Wilson Christopher J.,Van Besien Els,Beyer Gerald P.,Claeys Cor

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. Low dielectric constant materials for microelectronics

2. Effect of plasma interactions with low-κ films as a function of porosity, plasma chemistry, and temperature

3. M.R. Baklanov, A. Urbanowicz, G. Mannaert, S. Vanhaelemeersch, in: Proceedings of the Eighth International Conference on Solid-State and Integrated Circuit Technology Part 1, Shanghai, China, October 23–26, 2006, pp. 291–294.

4. Mechanisms of porous dielectric film modification induced by reducing and oxidizing ash plasmas

5. Mechanistic study of plasma damage of low k dielectric surfaces

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