1. Interface engineering for high interfacial strength between SiCOH and porous SiCOH interconnect dielectrics and diffusion caps
2. A.V. Kearney, A.V. Vairagar, H. Geisler, E. Zschech, R.H. Dauskardt, in: Proc. of the IITC, 2007, pp. 138–140.
3. T.M. Shaw, E. Liniger, G. Bonilla, J.P. Doyle, B. Herbst, X.H. Liu, M.W. Lane, in: Proc. of the IITC, 2007, pp. 114–116.
4. Evaluation of die edge cracking in flip-chip PBGA packages
5. M. Hecker, R. Hentschel, M. Hensel, M.U. Lehr, in: Proc. of the IITC, 2011, P2.33.