Evaluation of HfAlO high-k materials for control dielectric applications in non-volatile memories

Author:

Molas G.,Bocquet M.,Buckley J.,Grampeix H.,Gély M.,Colonna J.P.,Martin F.,Brianceau P.,Vidal V.,Bongiorno C.,Lombardo S.,Pananakakis G.,Ghibaudo G.,De Salvo B.,Deleonibus S.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference30 articles.

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4. Multi-level NAND flash memory with 63nm-node TANOS (Si–Oxide–SiN–Al2O3–TaN) cell structure;Lee;Tech. Dig. VLSI,2006

5. Highly manufacturable 32Gb multi-level NAND flash memory with 0.0098μm2 cell size using TANOS (Si–Oxide–Al2O3–TaN) cell technology;Park;Tech. Dig. IEDM,2006

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1. Reliability improvements of TiN/Al2O3/TiN for linear high voltage metal–insulator–metal capacitors using an optimized thermal treatment;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2017-01

2. Quantum Dot Nonvolatile Memories;Charge-Trapping Non-Volatile Memories;2015

3. The effect of annealing atmosphere on the (HfO2)0.9(Al2O3)0.1 based charge trapping nonvolatile memory;Vacuum;2014-01

4. Properties of HfAlO film deposited by plasma enhanced atomic layer deposition;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;2013-07

5. Influence of atomic layer deposition chemistry on high-k dielectrics for charge trapping memories;Solid-State Electronics;2012-02

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