Subject
Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics
Reference26 articles.
1. Integrated Circuits Thermal Test Method Environmental Conditions—Natural Convection (Still Air),2008
2. Semiconductor and IC Package Thermal Metrics,2012
3. Optimal thermal operation of liquid-cooled electronic chips;Sharma;Int. J. Heat Mass Transf.,2012
4. Microvortex-enhanced heat transfer in 3D-integrated liquid cooling of electronic chip stacks;Renfer;Int. J. Heat Mass Transf.,2013
5. Study of flow visualization in stacked-chip scale packages (S-CSP);Abdullah;Int. Commun. Heat Mass Transfer,2007
Cited by
20 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献