Investigation of natural convection heat transfer performance of the QFN-PCB electronic module by using nanofluid for power electronics cooling applications-Reference-Cited by-同舟云学术

Investigation of natural convection heat transfer performance of the QFN-PCB electronic module by using nanofluid for power electronics cooling applications

Published:2018-04 Issue:4 Volume:29 Page:996-1004
ISSN:0921-8831
Container-title:Advanced Powder Technology
language:en
Short-container-title:Advanced Powder Technology

Author:

Purusothaman A.

Funder

National Post-Doctoral Fellowship

Publisher

Elsevier BV

Subject

Mechanics of Materials,General Chemical Engineering

Reference29 articles.

1. Natural convection on inclined QFN32 electronic package generating constant volumetric heat flux;Bairi;Int. Commun. Heat Mass Transf.,2015

2. Thermal design of tilted electronic assembly with active QFN16 package subjected to natural convection;Bairi;Int. Commun. Heat Mass Transf.,2015

3. Effects of the wire-bonding technique on the QFN16b’s thermal performance. New correlations for the free convection heat transfer coefficient;Bairi;Int. Commun. Heat Mass Transf.,2015

4. Quantification of the natural convective heat transfer for the tilted and wire-bonded QFN32b-PCB electronic assembly;Bairi;Int. Commun. Heat Mass Transf.,2016

5. Free convective heat transfer for the wire-bonded and low powered QFN64b electronic device;Bairi;Int. Commun. Heat Mass Transf.,2016

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