Study of flow visualization in stacked-Chip Scale Packages (S-CSP)-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Study of flow visualization in stacked-Chip Scale Packages (S-CSP)

Published:2007-08 Issue:7 Volume:34 Page:820-828
ISSN:0735-1933
Container-title:International Communications in Heat and Mass Transfer
language:en
Short-container-title:International Communications in Heat and Mass Transfer

Author:

Abdullah M. Khalil,Abdullah M.Z.,Kamarudin S.,Ariff Z.M.

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics

Reference23 articles.

1. Fundamentals of Microsystems Packaging;Tummala,2001

2. Stacked Die Package Design Guidelines;Zhou,2004

3. Wafer Level Encapsulation—A Transfer Molding Approach to System in Package Generation, Electronics Packaging Technology Conference;Braun,2002

4. Triple-Chip Stacked CSP;Fukui,2000

5. Product information,2006

Cited by 19 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electronic packaging and thermal management;Polymers in Electronics;2023

2. Effect of different temperature distribution on multi-stack BGA package;Microelectronics International;2021-02-26

3. Effects of Multi-stack Ball Grid Array on Multi-stack Printed Circuit Board;IOP Conference Series: Materials Science and Engineering;2019-06-01

4. Study on the Fluid–Structure Interaction at Different Layout of Stacked Chip in Molded Packaging;Arabian Journal for Science and Engineering;2017-06-15

5. Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array;Microelectronics Reliability;2016-11

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP