Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates under temperature gradient-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates under temperature gradient

Published:2020-06 Issue: Volume:23 Page:100928
ISSN:2352-4928
Container-title:Materials Today Communications
language:en
Short-container-title:Materials Today Communications

Author:

Qiao Y.Y.,Zhao N.,Liu C.Y.,Wu C.M.L.,Wang Y.P.,Ma H.T.

Funder

National Natural Science Foundation of China

Dalian High-level Talents Innovation Support Program

Beijing Engineering Researching Center of Laser Technology

Publisher

Elsevier BV

Subject

Materials Chemistry,Mechanics of Materials,General Materials Science

Reference10 articles.

1. Recent progress on the development of Sn-Bi based low-temperature Pb-free solders;Wang;J. Mater. Sci.-Mater. Electron.,2019

2. Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper;Hsiao;Science,2012

3. Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on <111> oriented and nanotwinned Cu;Lin;Acta Mater.,2013

4. Dramatic morphological change of scallop-type Cu6Sn5 formed on (001) single crystal copper in reaction between molten SnPb solder and Cu;Suh;Appl. Phys. Lett.,2007

5. Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals;Zou;Acta Mater.,2008

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Influence of temperature gradient bonding on the micromorphology and shear performance of Sn-based solder joints: Experiments and first principles calculations;Journal of Manufacturing Processes;2024-07

2. Effect of Different Concentrations of Co Doping on the Properties of η′‐Cu₆Sn₅ and Ni₃Sn₄: First‐Principles Study;physica status solidi (b);2024-04-16

3. Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper;Heliyon;2024-03

4. Study of microstructure, growth orientations and shear performance of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints by using thermal gradient bonding;Materials Characterization;2023-09

5. Study on Cu6Sn5 morphology and grain orientation transition at the interface of (111) nt-Cu and liquid Sn;Journal of Materials Research and Technology;2023-09

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3