Shear performance of microscale ball grid array structure Cu(Ni)/Sn–3.0Ag–0.5Cu/Cu(Ni) solder joints at low temperatures
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Mechanics of Materials,General Materials Science
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1. Influence of nickel plating on the welding metallurgical mechanism, microstructure, and shear performance of C101/80Au20Sn/C101 solder joints;Materials Characterization;2024-09
2. Enhanced size effects on shear performance and fracture behavior of BGA structure micro-scale Cu/Sn–3.0Ag–0.5Cu/Cu joints at low temperatures;Microelectronics Reliability;2023-11
3. Minor Ag induced shear performance alternation in BGA structure Cu/SnBi/Cu solder joints under electric current stressing;Journal of Materials Research and Technology;2023-07
4. Microstructures and shear strengths of W-ball solder joints aged under isothermal and cyclic thermal conditions;Journal of Materials Science: Materials in Electronics;2023-03
5. Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature;Soldering & Surface Mount Technology;2022-10-25
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