Inhomogeneous deformation and microstructure evolution of Sn–Ag-based solder interconnects during thermal cycling and shear testing-Reference-Cited by-同舟云学术

Inhomogeneous deformation and microstructure evolution of Sn–Ag-based solder interconnects during thermal cycling and shear testing

Published:2012-06 Issue:6 Volume:52 Page:1112-1120
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Chen Hongtao,Han Jing,Li Jue,Li Mingyu

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference35 articles.

1. Solder joint reliability: materials, properties, and reliability;Tu,2007

2. Lead-free Solders in Microelectronics

3. Interfacial reactions between lead-free solders and common base materials

4. Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys

5. Chiu TC, Zeng K, Strierman R, Edwards D, Ano K. In: Proceedings of the 54th electronic components and technology conference; 2004. p. 1256–62.

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