Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys-Reference-Cited by-同舟云学术

Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys

Published:2004-12 Issue:12 Volume:33 Page:1412-1423
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Telang A. U.,Bieler T. R.,Lucas J. P.,Subramanian K. N.,Lehman L. P.,Xing Y.,Cotts E. J.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-004-0081-2.pdf

Reference11 articles.

1. K.N. Subramanian and J.G. Lee, J. Mater. Sci.: Mater. Electron. 15, 235 (2004).

2. D.W. Henderson et al., J. Mater. Res. 19, 1608 (2004).

3. A.U. Telang, T.R. Bieler, S. Choi, and K.N. Subramanian, J. Mater. Res. 17, 2284 (2002).

4. A.U. Telang, T.R. Bieler, M.A. Crimp, and K.N. Subramanian, submitted to Mater. Sci. Eng. A.

5. J.W. Morris, Jr. and H.L. Reynolds, in Design and Reliability of Solders and Solder Interconnects, eds. R.K. Mahidhara, D.R. Frear, S.M.L. Sastry, K.L. Murty, P.K. Liaw, and W.L. Winterbottom (Warrendale, PA: TMS, 1997), pp. 49–58.

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