Effects of Twin Boundary and Precipitates on Board Level Reliability in Sn-Ag-Cu(SAC) Solder Joints through EBSD Analysis
Author:
Affiliation:
1. SK hynix Inc.,Icheon,Republic of Korea
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195633.pdf?arnumber=10195633
Reference10 articles.
1. Effect of Crystal Boundary Character and Crystal Orientation on Electromigration in Lead-free Solder Interconnects with Cyclic Twinning Structure
2. Mechanical response of low stacking fault energy Co–Ni alloys – Continuum, mesoscopic and atomic level treatments
3. The influence of temperature on stacking fault energy in Fe-based alloys
4. The early stage dissolution of Ni and the nucleation of Ni–Sn intermetallic compound at the interface during the soldering of Sn–3.5Ag on a Ni substrate
5. Dislocation processes in the deformation of nanocrystalline aluminium by molecular-dynamics simulation
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