Author:
Guan Qilong,Hang Chunjin,Li Shengli,Yu Dan,Ding Ying,Wang Xiuli,Tian Yanhong
Abstract
AbstractThe spacecraft for deep space exploration missions will face extreme environments, including cryogenic temperature, intense radiation, wide-range temperature variations and even the combination of conditions mentioned above. Harsh environments will lead to solder joints degradation or even failure, resulting in damage to onboard electronics. The research activities on high reliability solder joints using in extreme environments can not only reduce the use of onboard protection devices, but effectively improve the overall reliability of spacecraft, which is of great significance to the aviation industry. In this paper, we review the reliability research on SnPb solder alloys, Sn-based lead-free solder alloys and In-based solder alloys in extreme environments, and try to provide some suggestions for the follow-up studies, which focus on solder joint reliability under extreme environments.
Funder
National Natural Science Foundation of China
Heilongjiang Touyan Innovation Team Program
Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
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