Author:
Schmidt R.,König C.,Prenosil P.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference8 articles.
1. Guth K, Oeschler N, Böwer L, Speckels R, Strotmann G, Heuck N, et al. Ciliox: new assembly and interconnect technologies for power modules, vol. 133. In: Proc CIPS2012, ETG-Fachbericht; 2012. p. 380–4.
2. Stockmeier T, Beckedahl P, Göbl C, Malzer T. SKiN: double side sintering technology for new packages. In: Proc ISPSD2011; 2011.
3. Siepe D, Bayerer R, Roth R. The future of wire bonding is? Wire bonding!, vol. 121. In: Proc CIPS2010, ETG-Fachbericht; 2010 [paper 3.7].
4. Schmidt R, Scheuermann U, Milke E. Al-clad Cu wire bonds multiply power cycling lifetime in advanced power modules. In: Proc PCIM2012; 2012.
5. Dalin J, Knauber A, Reiter R, Wesling V, Wilde J. Novel aluminum/copper fiber-reinforced bonding wires for power electronics. In: Proc ESTC2006; 2006. p. 1274–8.
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