Investigation on fatigue mechanism of solder layers in IGBT modules under high temperature gradients-Reference-Cited by-同舟云学术

Investigation on fatigue mechanism of solder layers in IGBT modules under high temperature gradients

Published:2023-02 Issue: Volume:141 Page:114901
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Zhao Shihan,Yang Xin,Wu Xinlong,Zhang Yue,Liu Guoyou

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference45 articles.

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3. Design for reliability in power electronics in renewable energy systems–status and future;Wang,2013

4. In situ diagnostics and prognostics of wire bonding faults in IGBT modules for electric vehicle drives;Ji;IEEE Trans. Power Electron.,2013

5. Lifetime prediction of IGBT modules in suspension choppers of medium/low-speed maglev train using an energy-based approach;Yang;IEEE Trans. Power Electron.,2018

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