Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb

Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb–Sn solder

Published:2006-02 Issue:2-4 Volume:46 Page:459-466
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Kim YoungBae,Noguchi Hiroshi,Amagai Masazumi

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference8 articles.

1. Mechanics of Pb40/Sn60 near-eutectic solder alloy subjected to vibration;Basaran;Appl Math Model,1998

2. Thermomechanical behavior of micron scale solder joints under dynamic loads;Zhao;Mech Mater,2000

3. Mechanical characterization of Sn–Ag-based lead-free solders;Amagai;Microelectron Reliab,2002

4. S. Liguore, D. Followell, Vibration Fatigue of Surface Mount Techology (SMT) Solder Joints, Pro annual reliability and maintainability symposium, 1995. p. 18–26.

5. Vibration reliability characterization of PBGA assembilies;Yang;Microelectron Reliab,2000

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