Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages-Reference-Cited by-同舟云学术

Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages

Published:2017-11 Issue: Volume:78 Page:355-361
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Wu Yuelin,Subramanian K.N.,Barton Scott Calabrese,Lee Andre

Funder

Semiconductor Research Corporation

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference36 articles.

1. Copper Wire Bonding;Chauhan,2014

2. Challenges and developments of copper wire bonding technology;Liu;Microelectron. Reliab.,2012

3. Copper Wire Bonding;Chauhan,2014

4. On the intermetallic corrosion of Cu-Al wire bonds;Boettcher,2010

5. Comparative reliability studies and analysis of Au, Pd-coated Cu and Pd-doped Cu wire in microelectronics packaging;Leong;PLoS ONE,2013

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