Funder
FAPESP-São Paulo Research Foundation, Brazil
CNPq - The Brazilian Research Council
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference41 articles.
1. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies;Puttlitz,2004
2. High-temperature lead-free solders: properties and possibilities;Suganuma;JOM-J. Met.,2009
3. Investigation of microhardness and thermo-electrical properties in the Sn–Cu hypereutectic alloy;Çadırlı;J. Mater. Sci. Mater. Electron.,2010
4. The effect of composition on microhardness and determination of electrical and thermal properties in the Sn-Cu alloys;Çadırlı;J. Mater. Sci. Mater. Electron,2011
5. Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliabilty;Lee,2015
Cited by
24 articles.
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