Interfacial reaction behavior and thermodynamics between Sn-xSb alloys and Cu substrate-Reference-Cited by-同舟云学术

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Interfacial reaction behavior and thermodynamics between Sn-xSb alloys and Cu substrate

Published:2023-06 Issue:6 Volume:33 Page:1839-1850
ISSN:1003-6326
Container-title:Transactions of Nonferrous Metals Society of China
language:en
Short-container-title:Transactions of Nonferrous Metals Society of China

Author:

WANG Rong-yue,YUAN Zhang-fu,ZHAO Hong-xin,YANG Xiao,HAO Yu-hui

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference36 articles.

1. Fracture behaviors of miniature size specimens of Sn–5Sb lead-free solder under tensile and fatigue conditions [J];KOBAYASHI;Procedia Engineering,2017

2. High-temperature lead-free solders: Properties and possibilities [J];SUGANUMA;JOM,2009

3. Cellular/dendritic transition, dendritic growth and microhardness in directionally solidified monophasic Sn–2%Sb alloy [J];ROCHA;Transactions of Nonferrous Metals Society of China,2018

4. Microstructure and impression creep behavior of lead-free Sn–5Sb solder alloy containing Bi and Ag [J];GERANMAYEH;Materials Science and Engineering A,2012

5. Segregation of Sn and Sb in a ternary Cu(100)SnSb alloy [J];ASANTE;Applied Surface Science,2005

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