Microstructure and impression creep behavior of lead-free Sn–5Sb solder alloy containing Bi and Ag
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference41 articles.
1. Interfacial reactions and growth kinetics for intermetallic compound layer between In–48Sn solder and bare Cu substrate
2. Creep deformation characteristics of tin and tin-based electronic solder alloys
3. Room-temperature indentation creep of lead-free Sn-5%Sb solder alloy
4. Tensile, creep, and ABI tests on sn5%sb solder for mechanical property evaluation
5. Creep of tin, Sb-solution-strengthened tin, and SbSn-precipitate-strengthened tin
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1. Simulation and Prediction of Creep Rate, Activation Energy, and Rupture Time of Sn94Sb5Ag1 Lead-Free Solder Alloy Using Artificial Neural Network Modeling;Journal of Electronic Materials;2024-07-02
2. Correlation of microstructure with thermal and tensile creep properties of novel Sn-5Sb-0.5Cu alloy reinforced with Co particles for soldering applications;Physica Scripta;2024-04-04
3. Interfacial reaction behavior and thermodynamics between Sn-xSb alloys and Cu substrate;Transactions of Nonferrous Metals Society of China;2023-06
4. Dislocation density and twinning-related constitutive modeling of substructural evolution in Sn-5Sb-0.5(Ag/Cu) alloys under monotonic deformation;Journal of Alloys and Compounds;2023-03
5. Synergetic role of Ni and GOns to improve the microstructure and mechanical creep rate of Sn-5.0Sb-0.7Cu solder alloy;Physica Scripta;2023-02-16
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