Fracture Behaviors of Miniature Size Specimens of Sn-5Sb Lead-Free Solder under Tensile and Fatigue Conditions

Author:

Kobayashi Kyosuke,Shohji Ikuo,Koyama Shinji,Hokazono Hiroaki

Publisher

Elsevier BV

Subject

Applied Mathematics

Reference13 articles.

1. High-temperature lead-free solder alternatives;Chidambaram;Microelectronic Engineering,2011

2. Microstructural evolution and tensile properties of Sn-5Sb solder alloy containing small amount of Ag and Cu;El-Daly;Journal of Alloys and Compounds,2011

3. Mechanical properties of Sn-0.7Cu/Si3N4 lead-free composite solder;Salleh;Materials Science and Engineering A - Structural Materials Properties Microstructure and Processing,2012

4. Thermal stability characterization of the Au-Sn bonding for high-temperature applications;Rodriguez;IEEE Trans-CPMT-A,2013

5. Effects of silver and antimony content in lead-free high-temperature solders of Bi-Ag and Bi-Sb on copper substrate;Nahavandi;Journal of Electronic Materials,2014

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