Reliability of Cu wire bonds in microelectronic packages-Reference-Cited by-同舟云学术

Reliability of Cu wire bonds in microelectronic packages

Published:2017-07 Issue: Volume:74 Page:147-154
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Mazloum-Nejadari A.^ORCID,Khatibi G.,Czerny B.,Lederer M.,Nicolics J.,Weiss L.

Funder

Austrian Federal Ministry of Science, Research and Economy

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference17 articles.

1. Wire Bonding in Microelectronics;Harman,2010

2. Towards adequate qualification testing of electronic products: review and extension;Khatibi,2014

3. Help, “Element Library”;Ansys Inc.,2015

4. Manifolds, Tensor Analysis, and Applications;Abraham,1988

5. Experimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnects;Czerny;Microelectron. Reliab.,2013

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