Fatigue behavior of Au, Cu and PCC fine wire bond connections for power LED applications
Author:
Affiliation:
1. University of Applied Sciences Burgenland Campus 1,Eisenstadt,7000
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10100701/10100725/10100839.pdf?arnumber=10100839
Reference13 articles.
1. Fatigue life time modelling of Cu and Au fine wires;khatibi;MATEC Web of Conferences EDP Sciences,2018
2. Loop formation effects on the lifetime of wire bonds for power electronics;von ribbeck;International Conference on Integrated Power Electronics Systems,2020
3. Cyclic robustness of heavy wire bonds: Al, AlMg, Cu and CucorAl
4. Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics;czerny;Journal of Microelectronics and Electronic Packaging,2022
5. Copper Wire Bonding
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1. Bond Wire Fatigue of Au, Cu, and PCC in Power LED Packages;Micromachines;2023-10-28
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